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Breaking?Capacity? 分?jǐn)嗄芰?/p> |
Material?材料 |
Operating?Temperature? 工作溫度 |
Soldering?conditions? 焊接條件 |
| 100?amperes?at?63V?DC??(250mA-4A) | Substrate - Ceramic/Glsdd Cover Termination?--??Sliver?over-plated with nickel?and?tin Element?--?Silver |
-40℃～+125℃ | Wave?solder:260℃,≤5S Hand?solder:?360℃,≤1S |
| 100?amperes?at?32V?DC??(4.5A-7A) | |||
| 150?amperes?at?24V?DC??(8A-20A) |
Functional ?Characteristics 電氣特性
| Amper?Rating?額定電流 | Testing?current?測(cè)試電流 | Blow?Time?熔斷時(shí)間 | |
| Min最小 | Max最大 | ||
| 250mA~20A | 100% | 4?hour | ?- |
| 250mA~20A | 250% | - | 5s |
| 250mA~20A | 300% | 0.1s | 3s |
| 250mA~20A | 1000% | 0.2ms | 20ms |
Approvals認(rèn)證（○ Pending表示認(rèn)證中 ● Approvals表示已獲認(rèn)證）
| Current?Rating?額定電流 | Voltage?Rating?額定電壓 | Marking標(biāo)示 | Norminal?Melting?I2T(A2sec) | Approvals?認(rèn)證 | |
 |
 |
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| 250mA | 63V | 0.25 | 0.002 | ● | ? |
| 375mA | 63V | E | 0.003 | ● | ? |
| 500mA | 63V | 0.5 | 0.005 | ● | ? |
| 750mA | 63V | 0.75 | 0.01 | ● | ? |
| 1A | 63V | H | 0.15 | ● | ○ |
| 1.25A | 63V | J | 0.16 | ● | ○ |
| 1.5A | 63V | K | 0.38 | ● | ○ |
| 2A | 63V | N | 0.88 | ● | ○ |
| 2.5A | 63V | O | 1.20 | ● | ○ |
| 3A | 63V | P | 1.85 | ● | ○ |
| 3.5A | 63V | R | 2.05 | ● | ○ |
| 4A | 63V | S | 2.70 | ● | ○ |
| 4.5A | 32V | X | 2.95 | ● | ○ |
| 5A | 32V | T | 3.80 | ● | ○ |
| 6A | 32V | U | 4.20 | ● | ○ |
| 7A | 32V | V | 5.50 | ● | ○ |
| 8A | 24V | W | 6.40 | ● | ○ |
| 10A | 24V | 10 | 10.0 | ● | ○ |
| 12A | 24V | 12 | 12.8 | ● | ○ |
| 15A | 24V | 15 | 22.5 | ○ | ○ |
| 20A | 24V | 20 | 40.0 | ○ | ○ |
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